Thursday 28 August 2008
1. Microelectronics Assembly
World-class Wire Bond & Flip Chip Class 100 facilities; Design to Mfg.
www.aspentechnologies.com
2. Live Semiconductor Packaging
Semiconductor packaging.
www.EARBid.com
3. Now Playing at Hitachi True Stories
Watch mini-movies about advanced Hitachi technology.
www.hitachi.us/truestories
4. Topline Dummy Semiconductor Package
Topline dummy semiconductor packages are low cost way to improve SMT assembly process. Full range of semiconductor packages.
www.topline.tv
5. View Engineering
Go from CAD file directly to dimensional measurement. Measure backend processes & packaged devices including wirebond position & size, lead position, seating plane, & package dimensions.
www.vieweng.com
6. Semiconductor Packagings
Industrial products and services! Find semiconductor packaging.
www.Industrial101.com
7. Semiconductor Packaging
Search Thousands of Catalogs Today for semiconductor packaging.
www.globalspec.com
8. Surface Preparation
Stainless steel surface preparation & smooth finishing services.
www.harrisonep.com
9. Electropolishing Plus
Electropolishing & Passivation Mobile Services & Oxygen Cleaning.
www.celcoinc.com
10. Polymer Surface Preparation Using Plasma
Surface preparation for polymers and other medical plastic materials.
www.pvateplaamerica.com
Format: Other - PACKAGE, Publisher: Springer Verlag (November 30, 2006), ISBN: 9780387241593
Release Date: November 30, 2006
Format: Hardcover, Publisher: Wiley-Interscience (December 24, 1998), ISBN: 9780471149590
Release Date: December 24, 1998
Format: Paperback, Publisher: Prentice Hall (November 01, 2000), ISBN: 9780130815200
Release Date: November 01, 2000
Format: Hardcover, Publisher: CRC Pr I Llc (October 01, 2002), ISBN: 9780849315626
Release Date: October 01, 2002